Hp Silicone Thermal Paste 100G, Thermal Paste 1.5 W/Mk, Silicone Thermopaste, Hp Cooling Paste, Hp Thermopaste… Vairāk

HP Silicone Thermal Conductive Paste is a flexible, white paste that ensures effective heat dissipation in electronic and electrical devices. Advantages and unique features • High thermal conductivity ≥ 1.5 W/mK for optimal cooling • Resistance to a wide temperature range from -50 °C to 250 °C • Non-conductive - full safety of electronic systems • Resistance to moisture, oxidation, acids, alkalis, salts, SO₂ and ammonia • Flexible, non-flowing consistency for easy application Properties and applications • Appearance: white paste with a density of ~2.1 g/cm³ (20 °C) • Thermal impedance: < 0.227 °C in²/W • Operating range: from −50 °C to 250 °C • No air saturation: low evaporation (0.001 %) and bleeding (0.05 %) • Application: modules with high conductivity coefficient, CPU/GPU cooling systems, LED diodes, HDD/SSD, consumer electronics, air conditioners, automotive electronics Parameter | Value Thermal conductivity | ≥ 1.5 W/mK Density (20 °C) | ~ 2.1 g/cm³ Operating temperature range | −50 °C … 250 °C Thermal impedance | < 0.227 °C in²/W Evaporation | 0.001 % Bleeding | 0.05 % Tixotropic index | 380 ± 10 Dielectric permittivity εr | 7.2 – 7.7 Shelf life | 3 years Store in a tightly closed container in a dry, cool and well-ventilated place, away from direct sunlight. Color: nan Size: 100g